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XSCAN-3080

Description

XSCAN-3080 is attachment automatic equipment. It can a fine point PCB product skill, STACK VIA, NMBI(Nero Manhattan Bump Interconnection), Flip-Chip, BGA , etc that those are Aligh and attach. Experience a life of efficiency make product by equipment suitable for advance a method of construction.



Features

PCB / BGA inspection

Geometric magnification

Pseudo 3D image display

Simple maintenance

High Resolution (option)

Easy to use

Inspection for BGA, PCB, MLB

User-friendly and easy to use

 

 

 

 


Spesification

X-ray Tube
Focus Size 33μm
Tube Current/Voltage/Power Max. 250μA/ 80kV/ 15W
Geometric Enlargement Ratio 3x to 20x
Enlargement Ratio on the Monitor 10x to 3000x
Aging (Preheating) Automatic
X-ray shield box and others
Dimension and Weight 540mm x 550mm x 1000mm (WxDxH), 150kg
Externally leaking dose 1uSv/h or less
Power Supply 220VAC±10% 50/60Hz



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